Overview
The ISD5008 ChipCorder product is a fully-integrated, single-chip solution that provides seamless integration of enhanced voice recording and playback features for digital cellular phones (GSM, CDMA, TDMA, PDC, and PHS), automotive communications, GPS/navigation systems, and portable communication products. This low-power, 3-volt product enables customers to quickly and easily integrate 4 to 8 minutes of voice storage features such as one-way and two-way (full duplex) call record, voice memo recording, and call screening/answering machine functionality
Like other ChipCorder products, the ISD5008 integrates the sampling clock, anti-aliasing and smoothing filters, and the multi-level storage array on a single chip. For enhanced voice features, the ISD5008 eliminates external circuitry by also integrating automatic gain control (AGC), a power amplifier/speaker driver, volume control, summing amplifiers, analog switches, and a car kit interface. Input-level adjustable amplifiers are also included, providing a flexible interface for multiple applications.
Part Number | ISD5008ZD |
Function | Single-Chip Voice Record / Playback Device |
Package | 28-Pin TSOP, 28-Pin Type |
Manufacturer | Winbond, ISD, Nuvoton |
Datasheet | Download PDF |
ISD5008ZD Features
Fully Integrated Solutions
- Single-chip voice record/playback solution
- Integrated sampling clock, anti-aliasing and smoothing filters, and multi-level storage array
- Integrated analog features such as automatic gain control (AGC), audio gating switches, speaker driver (23mW with 8-ohm load), summing amplifiers, volume control, and an AUX IN/AUX OUT interface (e.g., for car kits).
Low Power Consumption
- Single +3 volt supply
- Operating current:
- ICC Play = 15 mA (typical)
- ICC Rec = 25 mA (typical)
- ICC Feedthru = 12 mA (typical)
- Standby current: ISB = 1 µA
- Power consumption controlled by SPI or Microwire control register
- Most stages can be individually powered down for minimum power consumption
Enhanced Voice Features
- One or two-way (full duplex) conversation record (record signal summation)
- One- or two-way (full duplex) message playback (while on a call)
- Voice memo record and playback
- Private call screening
- In-terminal answering machine
- Personalized outgoing message (given caller ID information from host chipset)
- Private call announce while on call (given CIDCW information from host chipset)
Easy to use & Control
- No compression algorithm development is required
- ISD’s standard 100-year message retention (typical)
- 100,000 record cycles (typical)
ISD5008ZD Pinout
Pin Definitions
PIN NAME | PDIP/SOIC | TSOP | FUNCTION |
SCLK | 1 | 8 | Serial Clock: The SCLK is the clock input to the ISD5008. Generated by the master microcontroller, the SCLK synchronizes data transfers in and out of the device through the MISO and MOSI lines. |
SS | 2 | 9 | Master In Slave Out MISO is the serial data output of the ISD5008. Data is clocked out on the falling edge of SCLK. This output goes into a high-impedance state when the device is not selected. Data is clocked out of the device with LSB first. |
MOSI | 3 | 10 | Master Out Slave In: MOSI is the serial data input to the ISD5008 device. The master microcontroller places data to be clocked into the ISD5008 device on the MOSI line one-half cycle before the rising edge of SCLK. Data is clocked into the device with LSB (Least Significant Bit) first. |
MISO | 4 | 11 | Ground: The ISD5008 utilizes separate analog and digital ground buses. The analog ground (VSSA) pins should be tied together as close to the package as possible and connected through a low-impedance path to power supply ground. The digital ground (VSSD) pin should be connected through a separate low-impedance path to the power supply ground. These ground paths should be large enough to ensure that the impedance between the VSSA pins and the VSSD pins is less than 3 Ω. The backside of the die is connected to VSSD through substrate resistance. In a chip-on-board design, the die attach area must be connected to VSSD. |
VSSD / VSSA | 5, 6 / 9, 15, 23 | 12, 13 / 2, 15, 22 | Ground: The ISD5008 utilizes separate analog and digital ground buses. The analog ground (VSSA) pins should be tied together as close to the package as possible and connected through a low-impedance path to the power supply ground. The digital ground (VSSD) pin should be connected through a separate low-impedance path to the power supply ground. These ground paths should be large enough to ensure that the impedance between the VSSA pins and the VSSD pins is less than 3 Ω. The backside of the die is connected to VSSD through substrate resistance. In a chip-on-board design, the die attach area must be connected to VSSD. |
MIC+ / MIC- | 8 / 10 | 16 / 17 | Microphone +/–: The microphone inputs transfer the voice signal to the on-chip AGC preamplifier or directly to the ANA OUT MUX, depending on the selected path. The AGC circuit has a range of 45dB in order to deliver a nominal 694 mVp-p into the storage array from a typical electret microphone output of 2 to 20 mVp-p. The direct path to the ANA OUT MUX has a gain of 6dB so a 208 mVp-p signal across the differential microphone inputs would give 416 mVp-p across the ANA OUT pins. The input impedance is typically 10 kΩ. |
ANAOUT+ / ANAOUT- | 11 / 12 | 18 / 19 | Auxiliary Input: The AUX IN is an additional audio input to the ISD5008, such as from the microphone circuit in a mobile phone-car kit.‖ This input has a nominal 700 mVp-p level at its minimum gain setting (0dB). See Table 5. An additional gain is available in 3 dB steps (controlled by the SPI bus) up to 9 dB. |
ACAP | 13 | 20 | Power Supplies: To minimize noise, the analog and digital circuits in the ISD5008 device use separate power busses. These +3V busses lead to separate pins. Tie the VCCD pins together as close as possible and decouple both supplies as near to the package as possible |
SP- / SP+ | 14 / 16 | 21 / 23 | Speaker Outputs: This differential speaker output is designed to drive an 8Ω speaker up to a maximum power of 23.5 mW. This stage has two selectable gains, 1.32 and 1.6, which can be chosen through the configuration registers. These pins are biased to approximately 1.2 VDC and, if used single-ended, must be capacitively coupled to their load. Do NOT ground the unused pin. |
VCCA / VCCD | 17 / 27, 28 | 24 / 6, 7 | AGC Capacitor: This pin provides the capacitor connection for setting the parameters of the microphone AGC circuit. It should have a 4.7 µF capacitor connected to the ground. It cannot be floating. This is because the capacitor is also used in the playback mode for the AutoMute circuit. This circuit reduces the amount of noise present in the output during quiet pauses. Tying this pin to the ground gives maximum gain, or to VCCA gives minimum gain for the AGC amplifier but will cancel the AutoMute function. |
ANA IN | 18 | 25 | Analog Input: The ANA IN pin is the analog input from the telephone chipset. It can be switched (by the SPI bus) to the speaker output, the array input, or to various paths. This pin is designed to accept a nominal 1.11 Vp-p when at its minimum gain (6dB) setting. See Table 4. There is additional gain available in 3dB steps controlled from the SPI bus if required, up to 15 dB. |
AUX IN | 19 | 26 | Auxiliary Input: The AUX IN is an additional audio input to the ISD5008, such as from the microphone circuit in a mobile phone-car kit.‖ This input has a nominal 700 mVp-p level at its minimum gain setting (0dB). See Table 5. An additional gain is available in 3 dB steps (controlled by the SPI bus) up to 9dB. |
AUX OUT | 20 | 27 | Auxiliary Output: The AUXOUT is an additional audio output pin, to be used, for example, to drive the speaker circuit in a ―car kit.‖ It drives a minimum load of 5 kΩ and up to a maximum of 1 Vp-p. The AC signal is superimposed on approximately 1.2 VDC bias and must be capacitively coupled to the load. |
ISD5008ZD Datasheet
Download the ISD5008ZD IC Datasheet from the link given below.