Zynq-7000 SoC 256KB 444K Logic Cells XC7Z100-2FFG900I

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Overview

The integration enables a very adaptive and versatile system that may be tailored to meet specific application requirements. The XC7Z100-2FFG900I offers a wide range of features and functionalities, including fast connectivity options like Gigabit Ethernet, USB 2.0, and PCIe. Along with a variety of memory interfaces like DDR3 and LPDDR2, the device also supports a wide range of peripherals like SPI, I2C, and UART. Thanks to the FPGA fabric, users have the option to design original logic operations and accelerate processing tasks using hardware. Due to its mix of processing power and programmable logic, the XC7Z100-2FFG900I belonging to the Zynq-7000 SoC family is a fantastic choice for applications that demand high-performance computing and real-time processing capabilities. This device is well suited for use in a variety of applications, including industrial automation, aerospace and defense, medical imaging, and more, thanks to its cutting-edge features and adaptable architecture.

Part NumberXC7Z100-2FFG900I
PackageFCBGA-900
ManufacturerXilinx
DatasheetDownload PDF AM5890S pdf
XC7Z100-2FFG900I

XC7Z100-2FFG900I Features

  • Jazelle® RCT execution Environment Architecture
  • NEON™ media-processing engine
  • Single and double precision Vector Floating Point Unit (VFPU)
  • CoreSight™ and Proggram Trace Macrocell (PTM)
  • 2.5 DMIPS/MHz per CPU
  • CPU frequency: Up to 1 GHz
  • Coherent multiprocessor support
  • ARMv7-A architecture

The packaging in the 900-BBGA or FCBGA formats is dependable and effective for holding the electronic component. The operating temperature range for this device is -40 to 100 degrees Celsius (TJ), making it resistant to extreme conditions. The 900-FCBGA device package from the provider is 31×31 in size and has enough room for the component’s capabilities. This device, which operates at an amazing 800 MHz, can handle challenging jobs with ease. 1956 kbits of block RAM that are incorporated in the device offer extra memory space for storing and retrieving data. The 256 KB capacity of the DMA peripheral makes it perfect for high-speed data transfer operations. This device’s architecture, which combines MCU and FPGA components, offers versatility in terms of design and execution. Overall, the combination of these features makes this electronic component a powerful tool for a variety of applications.

XC7Z100-2FFG900I Specifications

SpecificationValue
CategoryIntegrated Circuits (ICs) Embedded System On Chip (SoC)
MfrAMD
SeriesZynq®-7000
PackageTray
Product StatusActive
ArchitectureMCU, FPGA
Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size
RAM Size256KB
PeripheralsDMA
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed800MHz
Primary AttributesKintex™-7 FPGA, 444K Logic Cells
Operating Temperature-40°C ~ 100°C (TJ)
Package / Case900-BBGA, FCBGA
Supplier Device Package900-FCBGA (31×31)
Number of I/O212
Base Product NumberXC7Z100

Applications

  • Artificial Intelligence
  • 5G Technology
  • Cloud computing
  • Consumer electronics
  • Wireless Technology
  • Industrial Control
  • Internet of Things
  • Medical Equipment

XC7Z100-2FFG900I Datasheet

Download the XC7Z100-2FFG900I IC Datasheet from the link given below.